Chip maker EnSilica has been awarded a major contract to supply a custom sensor ASIC for the rapidly growing e-mobility market. The deal, worth over $7 million across the first five years, will see EnSilica design and manufacture a mixed signal sensor chip for electric vehicles, e-bikes, e-scooters and other electrified transport.
With the non-recurring engineering costs fully funded by the client, EnSilica expects to complete the majority of design work this financial year, before commencing volume production in mid-2025.
The contract signals EnSilica’s entry into the high-growth e-mobility space, projected to reach $325 billion by 2030. With innovation driving demand for differentiated products, EnSilica’s ASIC capabilities position it strongly to capitalise on custom chip opportunities across electrified transport.
Ian Lankshear, Chief Executive Officer of EnSilica plc, commented:
“We are pleased to announce this new supply contract in a key growth market undergoing significant innovation and adoption globally. The technological demands across the e-mobility market are similar to those of the automotive market, and we look forward to capitalising on our proven automotive expertise to further expand our market reach.”